導師資訊

Research Building N21, 3/F, University of Macau, Avenida da Universidade, Taipa, Macau, China

澳門大學

澳門大學-模擬與混合信號集成電路全國重點實驗室

https://ime.um.edu.mo/people/cslam/

下一代集成电力电子电路和系统

Next-Generation Integrated Power Electronics Circuits and Systems

0809 电子科学与技术

0808 电气工程

Ph.D degree in the related area with solid experiences in integrated power electronics circuits and systems design

Ph.D. in Electrical and Electronics Engineering, University of Macau, Macao, China [Supervisor: Prof. Ying-Duo Han 韩英铎, Member of Chinese Academy of Engineering (中国工程院院士), Professor of Tsinghua University, Beijing, China]

Chi-Seng Lam received the Ph.D. degree in electrical and electronics engineering from the University of Macau (UM), Macau, China, in 2012. He completed the Clare Hall Study Programme at the University of Cambridge, Cambridge, U.K., in 2019. In 2013, he was a Postdoctoral Fellow with The Hong Kong Polytechnic University, Hong Kong, China. He is currently a Full Professor with the State Key Laboratory of Analog and Mixed-Signal VLSI and the Institute of Microelectronics, UM, and also with the Department of Electrical and Computer Engineering, Faculty of Science and Technology, UM. He has coauthored or co-edited five books and more than 220 technical journals and conference papers. He holds six U.S. and nine Chinese patents. His research interests include power quality compensators, photovoltaic energy generation system, power management integrated circuits, and wireless power transfer. Prof. Lam was the recipient or co-recipient of the IEEE PES Chapter Outstanding Engineer Award in 2016, the Gold Medal of the 48th Geneva International Exhibition of Inventions in 2023, and the Macao Science and Technology Invention Awards (Third Class, Second Class and Third Class) in 2014, 2018, and 2024 respectively. He is currently the Founding Chair of the IEEE Macau IES Chapter, Founding Chair of the IEEE TEC Macau Chapter, and the Vice-Chair of the IEEE IES Technical Committee on Power Electronics. He currently serves as an Associate Editor for the IEEE Transactions on Power Electronics, the IEEE Transactions on Industrial Electronics, the IEEE Transactions on Circuits and Systems – I: Regular Papers, the IEEE Journal of Emerging and Selected Topics in Power Electronics, the IEEE Open Journal of the Industrial Electronics Society, and the IEEE Access. He was awarded the 2024 IEEE Transactions on Industrial Electronics Outstanding Associate Editor and 2021 IEEE Access Outstanding Associate Editor, the 2022 and 2024 IEEE Transactions on Industrial Electronics Distinguished Reviewer, the 2024 IEEE Transactions on Power Electronics Outstanding Reviewer, and the 2024 Outstanding Reviewer by the IEEE Solid State Circuits Society. In addition, he has actively provided 7 tutorials at IEEE conferences: IECON2025, IECON2024, IPEMC 2024-ECCE Asia, PEDG 2023, ISCAS2021, IECON2020, APPEEC2019. Since 2020, he has also been recognized as the world’s top 2% scientists by Stanford University and Elsevier for five consecutive years. Prof. Lam is a Fellow of The Institution of Engineering and Technology (IET).

Power management integrated circuits, voltage reference integrated circuits, integrated circuits for PZT, power electronics converters, power quality compensation, PV energy generation system, wireless power transfer.

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1. Research and Development on Key Integrated Circuit Technologies for Future Intelligent Robots, Science and Technology Development Fund, Macao, China, FDCT 0004/2023/AKP, MOP 11,974,000 (08/06/2024 – 07/06/2027)
2. Research and Application of Efficient and Reliable Wireless Charging Technology for Electric Vehicles Based on Nanocrystalline Soft Magnetic Materials, Science and Technology Development Fund and Guangdong Provincial Department of Science and Technology Joint Research Project, Macao, China, FDCT 0187/2024/AGJ, MOP 1,031,000 (14/09/2025 – 13/09/2027)
3. Research on Efficient and Cost-Effective Dynamic Wireless Charging Technology Solutions and its Application Strategies for Warehouse-Oriented Automatic Guided Vehicles, Science and Technology Development Fund, Macao, China, FDCT 0110/2024/RIB2, MOP 1,756,000 (09/05/2025 – 08/05/2028)